This is a polycrystalline SiC bulk material manufactured via atmospheric pressure sintering, using high-purity SiC powder as the raw material.
It features the excellent thermal conductivity, high-temperature stability, mechanical strength, and wear resistance inherent to SiC, making it highly suitable as a base material for semiconductor manufacturing equipment components that demand harsh operating environments.
Available as large-diameter and thick-plate bulk materials, it can be precision-machined into various SiC components tailored to your specific applications and equipment specifications.

Main Applications

• Structural components for semiconductor manufacturing equipment
• Components for high-temperature processes
• Components for heat treatment equipment
• Heat-resistant and wear-resistant parts

We provide various precision machined products utilizing high-purity polycrystalline SiC for semiconductor manufacturing equipment.
We support custom machining tailored to your requirements, including size, shape, crystal orientation, and resistivity, in accordance with customer drawings and specifications.

Product	SiC Bulk Materials
Material	High-Purity Polycrystalline SiC
Size	300 mm
Thickness	30 mm

Product	SiC Dummy Wafers
Material	High-Purity Polycrystalline SiC
Size	8 inches	12 inches
Thickness	725 ± 20 μm	775 ± 20 μm
Surface Roughness	< 0.4 μm
Warp	< 100 μm