Tabletop Wrapping and Polishing Device
The tabletop wrapping and polishing device is a high-performance precision wrapping and polishing machine designed for small-scale production, capable of accommodating samples up to 6 inches in size. Post-processing samples achieve excellent flatness and high surface gloss.
This device is particularly suitable for diamond wrapping. By utilizing a high-rigidity housing and a uniquely developed water-cooled spindle, it maintains a constant temperature on the surface of the lapping plate while achieving low vibration and high-precision rotation.
Furthermore, it is compatible with a wide range of applications, including semiconductor, optoelectronics, and optics industries. The device comes equipped with the following standard polishing and wrapping functions:
- Adjustment of the rotation speed of the polishing plate
- Swing arm configuration
- Control of slurry (polishing liquid) drip rate
All these functions can be controlled and configured through an intuitive touchscreen interface, enabling precise process management.
| Model | TYD062 | TY061 | TY062 | TY064 |
|---|---|---|---|---|
| Number of Axes | 2 Stations | 1 Stations | 2 Stations | 4 Stations |
| Processing Materials | Diamond | Various brittle materials such as Si, SiC, Sapphire, GaN, GaSb, InP, CdZnTe, GaAs, LiNbO3, InSb, etc. | ||
| Supported Size | Up to 6 inches | |||
| Polishing Disc (mm) | 350 | 400 | 500 | |
| Vacuum | -0.8 ∼ 1.0 Bar | |||
| Water Pressure (Bar) | 3 ∼ 6 | |||
| Rotational Speed (rpm) | 5 ∼ 300 | 0 ∼ 100 | ||
| Power Supply | Single-phase 220 VAC, 10 A | Single-phase 220 VAC, 1500 W | ||
| Dimensions (W × D × H mm) | W690 × D800 × H600 | W650 × D830 × H600 | W1610 × D1060 × H2000 | |
| Weight (Kg) | 80 | 60 | 70 | 800 |
Replacement Parts for Wrapping Equipment
Ultra-Precision Grinding Jig
This jig is designed for ultra-precision grinding applications, specifically for processing high-performance materials that require nanometer-level surface finishing accuracy.
With stable holding performance and uniform pressure control, it minimizes workpiece displacement and shape changes during grinding, achieving exceptionally high flatness and surface roughness.
Features:
- High reproducibility achieved through an optimal workpiece holding mechanism
- Optimized pressure distribution ensuring a uniform polished surface
- Compatible with various brittle materials such as Si, SiC, Sapphire, GaN, GaSb, InP, CdZnTe, GaAs, LiNbO3, InSb, and more
- Designed to be adaptable for semi-automatic or fully automatic equipment
Compatible Sizes:
- Model: 1PP62 — Compatible with sizes up to 6 inches
- Model: 1PP42 — Compatible with sizes up to 4 inches
- Model: 1PP32 — Compatible with sizes up to 3 inches
Lapping Plate
Polishing Slurry Supply Container
